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Fabrication of high-performance p-type thin film transistors using atomic-layer-deposited SnO films
Ist Teil von
Journal of materials chemistry. C, Materials for optical and electronic devices, 2017, Vol.5 (12), p.3139-3145
Erscheinungsjahr
2017
Quelle
Alma/SFX Local Collection
Beschreibungen/Notizen
Here, we demonstrate high-performance p-type thin film transistors (TFTs) with a SnO channel layer grown by atomic layer deposition (ALD). The performance of the SnO TFTs relies on hole carriers and defects in SnO and near the back-channel surface of SnO as well as the quality of the gate dielectric/SnO interface. The growth of SnO films at a high temperature of 210 °C effectively suppresses the hole carrier concentration, leading to a high on-current/off-current (
I
on
/
I
off
) ratio. In addition, the SnO films grown at 210 °C achieve high field effect mobility (
μ
FE
) compared with the SnO films grown at lower temperatures because of their large grain size and lower impurity contents. However, the SnO films grown at 210 °C still contain defects and hole carriers, especially near the back-channel surface. The post-deposition process – back-channel surface passivation with ALD-grown Al
2
O
3
followed by post-deposition annealing at 250 °C – considerably alleviates the defects and hole carriers, resulting in superior TFT performance (
I
on
/
I
off
: 2 × 10
6
, subthreshold swing: 1.8 V dec
−1
,
μ
FE
: ∼1 cm
2
V
−1
s
−1
). We expect that the SnO ALD and subsequent process will provide a new opportunity for producing high-performance p-type oxide TFTs.