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Analytical approach for describing the collapse of surface asperities under compressive stress during rapid solid state bonding
Ist Teil von
Scripta materialia, 2017-02, Vol.128, p.41-44
Ort / Verlag
Elsevier Ltd
Erscheinungsjahr
2017
Link zum Volltext
Quelle
Alma/SFX Local Collection
Beschreibungen/Notizen
Many material manufacturing technologies, such as friction stir welding, rely on rapid solid state bonding to join metal surfaces. In this letter, a differential equation is developed to formulate the growing of the interfacial bonded area owing to the collapse of surface asperities under compressive stress during rapid solid state bonding of metal surfaces. The effect of pressure, temperature and bonding time on the growing of bonded area is discussed. The proposed approach is verified by experimental data.
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