Details

Autor(en) / Beteiligte

• Woods, M
• Fields, R G
• Holbrook, B
• Lander, R L
• Moskaleva, A
• Neher, C
• Pasner, J
• Tripathi, M
• Brau, J E
• Frey, R E
• Strom, D
• Breidenbach, M
• Freytag, D
• Haller, G
• Herbst, R
• Nelson, T
• Schier, S
• Schumm, B

Titel

Development of readout interconnections for the Si-W calorimeter of SiD

Ist Teil von

• Journal of instrumentation, 2011-12, Vol.6 (12), p.C12050-10

Ort / Verlag

IOP Publishing

Erscheinungsjahr

2011

Quelle

Alma/SFX Local Collection

Beschreibungen/Notizen

• The SiD collaboration is developing a Si-W sampling electromagnetic calorimeter, with anticipated application for the International Linear Collider. Assembling the modules for such a detector will involve special bonding technologies for the interconnections, especially for attaching a silicon detector wafer to a flex cable readout bus. We review the interconnect technologies involved, including oxidation removal processes, pad surface preparation, solder ball selection and placement, and bond quality assurance. Our results show that solder ball bonding is a promising technique for the Si-W ECAL, and unresolved issues are being addressed.