Details

Autor(en) / Beteiligte

• Li, C.C.
• Ke, J.H.
• Yang, C.A.
• Kao, C.R.

Titel

Mechanism of volume shrinkage during reaction between Ni and Ag-doped Sn

Ist Teil von

• Materials letters, 2015-10, Vol.156, p.150-152

Ort / Verlag

Elsevier B.V

Erscheinungsjahr

2015

Quelle

Alma/SFX Local Collection

Beschreibungen/Notizen

• The volume shrinkage during the solid-state reaction in Ag-doped Sn micro-joints for three-dimensional integrated-circuit applications is measured. It is found that more than 94% of the volume shrinkage is accommodated by height reduction of the micro-joints. This observation is in sharp contrast to results of a previous study in which no Ag was added, and the volume shrinkage occurred through both height reduction and void formation. A mechanism that accounts for this difference is proposed. •With 3.0wt% Ag doping, no micro-voids formed after Sn exhausted.•The volume shrinkage is dissipated only through height reduction for Ag-doped Sn.•The formation of micro-voids of Ni/Sn/Ni is due to the Kirkendall effect.•The larger reduction in joint height might introduce a higher internal stress.