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► High quality deep ablation of Sapphire using ultra-short laser pulses is demonstrated. ► Characterization of large area laser ablation in terms of pulse energy, scanning speed and scanning pattern is performed. ► Best performance is achieved at low power and low scan speed (100μJ, 90μm/s; at 1kHz). ► The process parameters and ablation depth are significantly different than those of hole drilling and line cutting.
The superior optical and mechanical properties of Sapphire (Al2O3) are highly desirable in various opto-electronics and micro-mechanical applications. However, Sapphire's intrinsic hardness and resistance to most chemicals result in significant processing difficulties. Laser micro-machining is emerging as a promising technology, in particular, the use of ultra-short pulses for material ablation. In this work we investigate and characterize experimentally large volume ablation of Sapphire with femtosecond pulses, and compare the results to previously reported drilling and cutting experiments. We manage to identify optimized parameters for overcoming deleterious thermal effects and debris scattering, and demonstrate high quality 180μm-deep ablation of 1mm×15mm area in Sapphire.