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Electroless Pd–Ni–P alloy plating from ammonium–ethylenediamine solution
Ist Teil von
Thin solid films, 2012-12, Vol.524, p.197-204
Ort / Verlag
Amsterdam: Elsevier B.V
Erscheinungsjahr
2012
Quelle
Alma/SFX Local Collection
Beschreibungen/Notizen
The peculiarities of Pd–Ni–P alloy electroless plating from hypophosphite ammonium–ethylenediamine solutions have been investigated. A simple and effective method to control the alloy composition based on varying pH in the solution has been found. It has been detected that the lowering of pH from 12.0 to 7.6 stimulates a decrease in the partial rate of Pd(II) reduction and provides enrichment of the alloy with nickel from 0.3 to 82at.%. Simultaneous reduction of palladium and nickel with hypophosphite enables the formation of alloy containing amorphous palladium, solid solution of palladium in nickel, palladium and nickel phosphides. Alloying proceeds with an effect of depolarization inherent to both metals. The experimental results show that effectiveness of Pd and Ni alloying process arises from palladium cementation with nickel and acceleration of catalytic hypophosphite oxidation on freshly reduced palladium or nickel.
► Pd–Ni–P alloys were deposited from hypophosphite-ammonium–ethylenediamine solutions. ► pH drop in solution from 12.0 to 7.6 controlled the rise in Ni content up to 82at.%. ► Alloys contain amorphous Pd, solid solution of Pd in Ni, metal phosphides. ► The alloying proceeds by Pd cementation with Ni and catalytic H2PO2−-ions oxidation. ► Pd and Ni freshly reduced at the alloying are effective catalysts in H2PO2− oxidation.