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Depth profiles of Al impurities implanted in Si wafers determined by means of the high-resolution grazing emission X-ray fluorescence technique
Ist Teil von
Spectrochimica acta. Part B: Atomic spectroscopy, 2010-06, Vol.65 (6), p.445-449
Ort / Verlag
Elsevier B.V
Erscheinungsjahr
2010
Quelle
Elsevier ScienceDirect Journals
Beschreibungen/Notizen
The synchrotron radiation based high-resolution grazing emission X-ray fluorescence (GEXRF) technique was used to extract the distribution of Al ions implanted with a dose of 10
16 atoms/cm
2 in Si wafers with energies ranging between 1 and 100
keV. The depth distributions of the implanted ions were deduced from the measured angular profiles of the Al-K
α X-ray fluorescence line with nanometer-scale precision. The experimental results were compared to theoretical predictions of the depth distributions resulting from ion implantation. A good agreement between experiment and theory was found which proved that the presented high-resolution grazing emission X-ray fluorescence technique is well suited to perform depth profiling measurements of impurities located within the extinction depth, provided the overall shape of the distribution can be assumed a priori.