Details

Autor(en) / Beteiligte

• Zhang, K K
• Li, C Y
• Qiu, R F
• Shi, H X
• Wang, Y L

Titel

Effect of Ni on growing of intermetallic compound in interface of Sn2.5Ag0.7Cu0.1RE/Cu solder joint during aging

Ist Teil von

• Materials science and technology, 2012-06, Vol.28 (6), p.760-765

Ort / Verlag

London: Taylor & Francis Ltd

Erscheinungsjahr

2012

Quelle

Alma/SFX Local Collection

Beschreibungen/Notizen

• Aging treatment was implemented for the Sn2-5Ag0-7Cu0-1RExNi/Cu solder joint under various temperatures simulating the service environment. The growing behaviour of the intermetallic compound at the soldering interface during aging was investigated. In the case of adding 0-1%Ni aged solder joint, the maximum growth activation energies of ... and ... are 86-8 and 93-7 kJ mol... respectively. The results reveal that the growth of intermetallic compound in the soldering interface can be suppressed, and the solder joint can be strengthened by adding proper quantities of Ni in the solder. (ProQuest: ... denotes formulae/symbols omitted.)