Journal of materials science. Materials in electronics, 2010-08, Vol.21 (8), p.772-778
2010
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Details
- Autor(en) / Beteiligte
- Titel
- Effect of ultrasonication medium on the properties of copper nanoparticle-filled epoxy composite for electrical conductive adhesive (ECA) application
- Ist Teil von
- Journal of materials science. Materials in electronics, 2010-08, Vol.21 (8), p.772-778
- Ort / Verlag
- Boston: Springer US
- Erscheinungsjahr
- 2010
- Quelle
- Alma/SFX Local Collection
- Beschreibungen/Notizen
- In this study, the relationship of three different media, (air, epoxy fluid, and chloroform solution) on the electrical, mechanical, and thermal properties of 5 vol.% copper nanoparticle (CuNP)-filled epoxy nanocomposite was investigated. Microscopic observation revealed that the CuNP ultrasonicated with chloroform solution exhibited the best filler distribution in the epoxy matrix. It showed high electrical conductivity of 7.65 × 10 −3 S cm −1 and flexural properties, and low coefficient of thermal expansion (CTE) compared with the other two nanocomposites. However, CuNP prepared by chloroform medium showed inferior thermal property compared with the other two nanocomposites according to thermogravimetric analysis (TGA).
- Sprache
- Englisch
- Identifikatoren
- ISSN: 0957-4522eISSN: 1573-482XDOI: 10.1007/s10854-009-9991-3Titel-ID: cdi_proquest_journals_871514765
- Format
- –
- Schlagworte
- Applied sciences, Characterization and Evaluation of Materials, Chemistry and Materials Science, Condensed matter: structure, mechanical and thermal properties, Cross-disciplinary physics: materials science, rheology, Exact sciences and technology, Materials Science, Mechanical and acoustical properties, Mechanical and acoustical properties of condensed matter, Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology, Mechanical properties of nanoscale materials, Metals. Metallurgy, Nanopowders, Nanoscale materials and structures: fabrication and characterization, Optical and Electronic Materials, Physical properties of thin films, nonelectronic, Physics, Surfaces and interfaces, thin films and whiskers (structure and nonelectronic properties)