Details

Autor(en) / Beteiligte

• Djema, Oussama
• Moussi, Abderrahmane
• Chaouchi, Sofiane
• Yaddaden, Chafiaa
• Berouaken, Malika
• Meziani, Samir

Titel

Effects of Bath Composition, Current Density and Annealing Conditions on the Properties of the Electrodeposited Ni Seed Layer for Cu Contacts in Si Solar Cells

Ist Teil von

• Journal of electronic materials, 2024-08, Vol.53 (8), p.4751-4761

Ort / Verlag

New York: Springer US

Erscheinungsjahr

2024

Quelle

SpringerLink

Beschreibungen/Notizen

• This work aims to investigate the effect of the bath composition, current density and annealing conditions on the properties of the electrodeposited nickel (Ni) seed layer for copper (Cu) contacts in silicon (Si) solar cells. For this purpose, electroplating experiments were performed using two bath compositions and applying various current densities. The electrodeposited Ni layers were investigated using scanning electron microscopy (SEM), energy-dispersive x-ray spectroscopy (EDS) and sheet resistance. The results showed that the bath composition and the current density affected the surface morphology, thickness, elemental composition and sheet resistance of the Ni layers. The Ni layers were then annealed at temperatures of 350°C and 400°C under N 2 atmosphere and vacuum to obtain the nickel silicide phases, which lower the contact resistivity between Ni and Si. The nickel silicide phases were investigated by diffraction (XRD). The results showed that the annealing conditions affected the formation of the nickel silicide phases.