Sie befinden Sich nicht im Netzwerk der Universität Paderborn. Der Zugriff auf elektronische Ressourcen ist gegebenenfalls nur via VPN oder Shibboleth (DFN-AAI) möglich. mehr Informationen...
Effect of self‐bias voltage on the nanoscale morphological properties of corn starch‐based films modified by hexamethyldisiloxane plasma
Ist Teil von
Plasma processes and polymers, 2024-02, Vol.21 (2), p.n/a
Ort / Verlag
Weinheim: Wiley Subscription Services, Inc
Erscheinungsjahr
2024
Quelle
Wiley-Blackwell Journals
Beschreibungen/Notizen
Thermoplastic starch (TPS) films underwent casting and plasma coating with Hexamethyldisiloxane (HMDSO) gas at various self‐bias voltages. Scanning electron microscopy (SEM) and atomic force microscopy (AFM) imaging revealed slight swelling and grain structures in untreated TPS films due to starch dissolution. However, the HMDSO plasma treatment had minimal impact, with swollen grains still present beneath a layer of small granules. Contact angle measurements demonstrated that untreated films had an initial water contact angle of 32°, gradually decreasing over time. Conversely, HMDSO‐coated films exhibited stable hydrophobic behavior, with contact angles exceeding 100°. Statistical analysis confirmed TPS films’ lower average roughness, while modified films showed no significant difference in height parameters. Higher self‐bias voltages correlated with larger grain sizes. Notably, experimental treatments decreased long‐range spatial correlations, as indicated by Hurst's exponent.
Our findings prove that the Hexamethyldisiloxane (HMDSO) modifies the surface of thermoplastic starch (TPS) films, generating a film with unique spatial patterns after being subjected to a self‐bias voltage of –100 V.