Details

Autor(en) / Beteiligte

• Shen, Yu-An

Titel

Bi Dispersion Hardening in Sn-Bi Alloys by Solid-State Aging

Ist Teil von

• JOM (1989), 2023-11, Vol.75 (11), p.4922-4930

Ort / Verlag

New York: Springer US

Erscheinungsjahr

2023

Quelle

Alma/SFX Local Collection

Beschreibungen/Notizen

• In this study, Bi was added to pure Sn to improve its strength and thermal properties. The presence of 2.5 and 5 wt.% Bi in the Sn matrix lowered the melting point of Sn from 232°C to 229°C and 225°C, respectively. The hardness was improved by increasing the Bi content; 2.5 wt.% Bi caused solid-solution hardening, whereas 5 wt.% Bi caused solid-solution, fine-grain, and Bi precipitation hardening. Sn with 5 wt.% Bi was reinforced by aging, which was attributed to dispersion hardening by Bi redistribution in the Sn matrix, and possessed good wettability on Cu. This study demonstrated that Sn with 5 wt.% Bi with good wettability has a good melting point, excellent hardness, and aging enhancement compared to pure Sn. Thus, this study provides mechanistic insights into the hardening of Sn-Bi alloys.