Details

Autor(en) / Beteiligte

• Hu, Yu‐Fan
• Zhou, Xue‐Jun
• Ni, Shi‐Hao
• Wu, Feng‐Yang
• Zong, Ji‐You
• Yang, Tai‐Bao
• Yan, Ding‐Xiang
• Tang, Jian‐Hua
• Lei, Jun
• Li, Zhong‐Ming

Titel

Spherical boron nitride/silicone rubber composite with high isotropic thermal conductivity via pre‐constructing thermally conductive networks

Ist Teil von

• Journal of applied polymer science, 2022-10, Vol.139 (38), p.n/a

Ort / Verlag

Hoboken, USA: John Wiley & Sons, Inc

Erscheinungsjahr

2022

Quelle

Wiley Online Library

Beschreibungen/Notizen

• Thermal interface material (TIM) is crucial for electronic devices to dissipate heat, but the high interface thermal resistance between polymer matrix and filler is a major problem affecting its thermal conductivity (TC). In this study, we prebuilt excellent thermally conductive pathway of isotropic spherical boron nitride (sBN) using a facile method, that is, pressing fillers, to decrease the interface thermal resistance before filling matrix silicon rubber (SR), and prepared a TIM with high isotropic TC. At 50 wt% filler content, the through‐plane and in‐plane TCs of sBN/SR composite reached 9.36 and 7.82 W/(m·K), respectively, which are higher than the highest value of previous research on bulk BN/SR composites (not including film), 4.13 and 6.56 W/(m·K), respectively. Meanwhile, the thermal decomposition temperature of TIM is 47.2°C higher than that of pure SR. In addition, the TIM has a low hardness (shore A hardness <70) and can be bent and folded, so can be used to substitute traditional thermally conductive silicone pad.