Details

Autor(en) / Beteiligte

• Huang, Chung-Ping
• Lee, Ting-Yu
• Yang, Jhen-Jia
• Lin, Guan-Teng
• Lin, Chien-Chung

Titel

A Metal-Embedded Packaging Structure for Performance Enhancement in Quantum-Dot-Converted LEDs

Ist Teil von

• IEEE photonics journal, 2021-08, Vol.13 (4), p.1-8

Ort / Verlag

Piscataway: IEEE

Erscheinungsjahr

2021

Quelle

EZB Electronic Journals Library

Beschreibungen/Notizen

• A Sn-ball was integrated with a colloidal quantum dot light-emitting diode package to achieve effective heat and reliability management. The electric, optical intensity, and heat distributions of the package were evaluated under various radiant fluxes; data were collected at the 90th hour of aging. Under 1 W/cm 2 , the areal temperature decreased from 38.5 °C (without Sn-ball) to 32.3 °C (with Sn-ball), which helped extend the lifetime of the colloidal quantum dots in the package. Specifically, the introduction of the metal ball structure engendered a two- to three-fold increase in lifetime. The study findings could contribute toward integrating quantum dots into photonic devices.