Details

Autor(en) / Beteiligte

• Yang, T.Y.
• Ge, T.S.
• Lu, F.L.
• Dai, Y.J.
• Wang, R.Z.

Titel

A novel semi-coupled solid desiccant heat pump system - Part 1: Simulation study

Ist Teil von

• International journal of refrigeration, 2020-12, Vol.120, p.150-160

Ort / Verlag

Paris: Elsevier Ltd

Erscheinungsjahr

2020

Quelle

Alma/SFX Local Collection

Beschreibungen/Notizen

• •A novel semi-coupled solid desiccant heat pump system is proposed.•A mathematical model of the novel system is established.•Some of the designed parameters is optimized with the model.•Novel system can supply air with lower temperature and temperature variation. Solid desiccant heat pump system (SDHP) can handle sensible and latent heat load simultaneously with high coefficient of performance (COP). However, in such system, supply air temperature is relatively high and unstable due to the frequent switch between desiccant coated heat exchanger as evaporator and condenser. In order to overcome these drawbacks, the concept of semi-coupled solid desiccant heat pump (SCSDHP) system is proposed in this paper, then a mathematical model is established to investigate the feasibility of this novel system. Calculation shows that under ARI (Air-conditioning and Refrigeration Institute) summer condition silica gel coating with density of 0.25 kg m−2 is optimal, and area ratio between desiccant coated evaporator and conventional evaporator of 1:1 is recommended. Furthermore, compared with conventional SDHP system, supply air temperature can be 4.5~7°C lower and the variation range of supply air temperature decreases by 16~21°C. Also, effects of main operating parameters including the temperature and relative humidity of outdoor air on the performance of SCSDHP system are investigated.