Details

Autor(en) / Beteiligte

• TAWARA, Yoshihiro
• UNEDA, Michio

Titel

Study of polishing characteristics of glass substrate by suede pad: effects of suede pad surface asperity on removal rate and stability

Ist Teil von

• Journal of the Japan Society for Abrasive Technology, 2020/03/01, Vol.64(3), pp.152-157

Ort / Verlag

Tokyo: The Japan Society for Abrasive Technology

Erscheinungsjahr

2020

Link zum Volltext

Quelle

EZB Free E-Journals

Beschreibungen/Notizen

• In the double-sided polishing of glass substrates using suede pads, the polishing rate gradually decreases with polishing time. It was assumed that the pad surface properties affect the friction coefficient. This study was performed to verify the effects of the contact rate by contact image analysis using a prism. In a continuous 6-batch polishing test using a single-sided single-wafer polishing machine with a suede pad, it was confirmed that the contact ratio increased markedly as the number of batches progressed. The extreme increase in contact ratio reduces the friction coefficient and decreases the polishing rate by reducing retention of the slurry containing abrasive grains at the polishing interface.