Details

Autor(en) / Beteiligte

• Meschini, M
• Ceccarelli, R
• Dinardo, M
• Gennai, S
• Moroni, L
• Zuolo, D
• Demaria, L
• Monteil, E
• Gaioni, L
• Messineo, A
• Currás, E
• Duarte, J
• Fernández, M
• Gómez, G
• García, A
• González, J
• Silva, E
• Vila, I
• GF Dalla Betta
• Mendicino, R
• Boscardin, M

Titel

First results on 3D pixel sensors interconnected to the RD53A readout chip after irradiation to 1×1016 neq cm−2

Ist Teil von

• Journal of instrumentation, 2019-06, Vol.14 (6)

Ort / Verlag

Bristol: IOP Publishing

Erscheinungsjahr

2019

Link zum Volltext

Quelle

Alma/SFX Local Collection

Beschreibungen/Notizen

• Results obtained with 3D columnar pixel sensors bump-bonded to the RD53A prototype readout chip are reported. The interconnected modules have been tested in a hadron beam before and after irradiation to a fluence of about 1×1016 neq cm−2 (1 MeV equivalent neutrons). All presented results are part of the CMS R&D activities in view of the pixel detector upgrade for the High Luminosity phase of the LHC at CERN (HL-LHC) . A preliminary analysis of the collected data shows hit detection efficiencies around 97% measured after proton irradiation.