Details

Autor(en) / Beteiligte

• Kim, Sejeong
• Duong, Ngoc My Hanh
• Nguyen, Minh
• Lu, Tsung‐Ju
• Kianinia, Mehran
• Mendelson, Noah
• Solntsev, Alexander
• Bradac, Carlo
• Englund, Dirk R.
• Aharonovich, Igor

Titel

Integrated on Chip Platform with Quantum Emitters in Layered Materials

Ist Teil von

• Advanced optical materials, 2019-12, Vol.7 (23), p.n/a

Ort / Verlag

Weinheim: Wiley Subscription Services, Inc

Erscheinungsjahr

2019

Quelle

Wiley Online Library Core Title

Beschreibungen/Notizen

• Integrated quantum photonic circuitry is an emerging topic that requires efficient coupling of quantum light sources to waveguides and optical resonators. So far, great effort is devoted to engineering on‐chip systems from 3D crystals such as diamond or gallium arsenide. In this study, room‐temperature coupling is demonstrated of quantum emitters embedded in layered hexagonal boron nitride to an on‐chip aluminum nitride waveguide. 1.35% light coupling efficiency is achieved in the device and transmission of single photons through the waveguide is demonstrated. The results serve as foundation for integrating layered materials to on‐chip components and realizing integrated quantum photonic circuitry. A hexagonal boron nitride (hBN) flake with a single emitter, coupled to an aluminum nitride waveguide, is depicted in the TOC image. Coupling of the quantum emitters in hBN, and realizeing transmission through the waveguide are demonstrated in the paper. Coupling efficiency is measured, and supported by a Finite‐difference time‐domain calculations.