Sie befinden Sich nicht im Netzwerk der Universität Paderborn. Der Zugriff auf elektronische Ressourcen ist gegebenenfalls nur via VPN oder Shibboleth (DFN-AAI) möglich. mehr Informationen...
With the growing demand for automotive LiDAR and the maturation of silicon photonics platforms, optical phased arrays (OPAs) have emerged as a key technology for solid-state optical beam-steering. In order to meet realistic automotive specifications with OPAs, >500 antenna elements should work reliably under tight power and cost budgets. Existing multi-chip solutions necessitate expensive packaging and assembly to achieve high interconnect density. Even with 2-D monolithic integration, high-voltage drivers to deliver sufficient power to resistive phase shifters typically result in significant overhead in die area and limited power efficiency. In this article, we introduce a single-chip OPA realized through wafer-scale 3-D integration of silicon photonics and CMOS. Flexible and ultra-dense connections with through-oxide vias (TOVs) in our platform resolve the I/O density issue. Moreover, low-voltage L-shaped phase shifters and compact, efficient switch-mode drivers, connected vertically using TOVs, remove wiring/placement overhead and achieve a large active array aperture within a compact die. Our OPA prototype achieves wide-range 2-D steering over 18.5°×16° by leveraging wavelength tuning and phase control, and array scaling up to 125 elements with a large aperture size of 0.5 mm×0.5 mm and 0.15°×0.25° beamwidth while consuming 20 mW/element average power. Since our system supports per-element independent phase control, increased sensitivity to process variations in L-shaped shifters is fully compensated by a simple calibration process.