Details

Autor(en) / Beteiligte

• Lee, Min
• Kwon, Youn-Suk
• Lee, Chun-Kyu

Titel

Effect of warpage on the operation of a rapid cooling and heating device

Ist Teil von

• Journal of the Brazilian Society of Mechanical Sciences and Engineering, 2019-08, Vol.41 (8), p.1-8, Article 322

Ort / Verlag

Berlin/Heidelberg: Springer Berlin Heidelberg

Erscheinungsjahr

2019

Quelle

Alma/SFX Local Collection

Beschreibungen/Notizen

• Warpage of an injection molding product is caused by residual stresses from non-uniform cooling. In this paper, rapid cooling and heating devices were developed using a peltier module. Through a finite element program, it was confirmed that heat was transferred and maintained uniformly in a short time. With a traditional water cooling system and the rapid cooling and heating system developed here, warpage results were compared and analyzed. The injection molding conditions of the packing time, mold temperature, cooling time, and packing pressure were measured and compared. The cooling method of rapid cooling and heating devices undergoes less warpage than that in the conventional water cooling method, and uniform cooling was noted. The state of a polymer tested with the proposed system was confirmed by SEM photographs. The conventional water-cooling method shows a slow growth rate of a component’s morphology when the component is produced at a high mold temperature, and the rapid cooling and heating method leads to a rapid growth rate of a component’s morphology when the component is produced at a high mold temperature. This indicates that the cooling is uniform and that the internal stress decreases as the temperature of the mold slowly decreases.