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New routes to organometallic molecular junctions via a simple thermal processing protocol
Ist Teil von
Journal of materials chemistry. C, Materials for optical and electronic devices, 2019, Vol.7 (22), p.6630-6640
Ort / Verlag
Cambridge: Royal Society of Chemistry
Erscheinungsjahr
2019
Quelle
Alma/SFX Local Collection
Beschreibungen/Notizen
Methods for forming single- and multiple-molecule junctions are key to the development of molecular electronics and the further study of allied electronic and electrical properties of molecules arising from through-molecule charge transport. The organometallic complex
trans
-Ru(CC-3-C
4
H
3
S)(CC-1,4-C
6
H
4
CCAuPPh
3
)(dppe)
2
forms well-ordered, densely packed self-assembled monolayers on gold and silver substrates, contacted through the sulfur atoms of the thiophenyl groups. Upon mild thermal treatment (150–200 °C, two hours) the gold moiety decomposes to liberate PPh
3
and form quite uniform, disc-shaped gold nanoparticles on top of the organometallic monolayer. The resulting molecular junctions give rise to sigmoidal shaped
I
–
V
curves characteristic of through-molecule conductance, rather than linear, ohmic traces associated with metallic contacts (
i.e.
short circuits). This work therefore demonstrates the feasibility of thermal processing routes to form good quality molecular junctions from organometallic complexes of relatively complex molecular structure capped with uniformly-shaped nanoparticles formed
in situ
.