Details

Autor(en) / Beteiligte

• Thompson, Patrick B.
• Johnson, Richard
• Nadimpalli, Siva P.V.

Titel

Effect of temperature on the fracture behavior of Cu/SAC305/Cu solder joints

Ist Teil von

• Engineering fracture mechanics, 2018-08, Vol.199, p.730-738

Ort / Verlag

New York: Elsevier Ltd

Erscheinungsjahr

2018

Link zum Volltext

Quelle

Alma/SFX Local Collection

Beschreibungen/Notizen

• •Thin layer of SAC305 solder was sandwiched between Cu bars to make DCB specimens.•DCBs were fractured under various temperatures to measure mode-I Jc.•The critical energy release rate of solder joints decreased with temperature.•The crack path shifts to SAC305-IMC interface at low temperature. Double cantilever beam (DCB) specimens consisting of Sn96.5Ag3.0Cu0.5 (SAC305) solder sandwiched between two copper bars were fabricated under standard surface mount processing conditions. Mode-I fracture tests were performed on the DCB specimens under various temperatures. The load–displacement behavior and critical loads corresponding to crack initiation were recorded and used in a finite element model of the DCB to evaluate critical energy release rates. Fracture surfaces were analyzed to understand the effect of temperature on crack path and fracture mechanism. The critical energy release rate decreased from 603 at −50 °C to 93 J/m2 at 100 °C and the crack path shifted from solder/intermetallic compound interface to bulk solder.