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Issues related to the implementation of Pb-free electronic solders in consumer electronics

Journal of materials science. Materials in electronics, 2007-03, Vol.18 (1-3), p.319-330

Frear, DR

2007

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Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu

Journal of materials research, 2002-02, Vol.17 (2), p.291-301

2002

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Electromigration of eutectic SnPb and SnAg3.8Cu0.7 flip chip solder bumps and under-bump metallization

Journal of applied physics, 2001-11, Vol.90 (9), p.4502-4508

2001

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Stress–Strain Characteristics of Tin-Based Solder Alloys for Drop-Impact Modeling

Journal of electronic materials, 2008-06, Vol.37 (6), p.829-836

2008

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Pb-free solders for flip-chip interconnects

JOM (1989), 2001-06, Vol.53 (6), p.28-33

2001

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Electromigration of eutectic SnPb solder interconnects for flip chip technology

Journal of applied physics, 2001-03, Vol.89 (6), p.3189-3194

2001

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Morphology of interfacial reaction between lead-free solders and electroless Ni–P under bump metallization

Journal of applied physics, 2000-12, Vol.88 (11), p.6359-6363

2000

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Influence of Substrate Surface Finish Metallurgy on Lead-Free Solder Joint Microstructure with Implications for Board-Level Reliability

Journal of electronic materials, 2020-05, Vol.49 (5), p.3251-3258

2020

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Solder reaction-assisted crystallization of electroless Ni–P under bump metallization in low cost flip chip technology

Journal of applied physics, 1999-06, Vol.85 (12), p.8456-8463

1999

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Correction to: Influence of Substrate Surface Finish Metallurgy on Lead-Free Solder Joint Microstructure with Implications for Board-Level Reliability

Journal of electronic materials, 2020-07, Vol.49 (7), p.4466-4467

2020

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Solid-state annealing behavior of two high-Pb solders, 95Pb5Sn and 90Pb10Sn, on Cu under bump metallurgy

Journal of electronic materials, 2005-10, Vol.34 (10), p.L43-L46

2005

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Wetting reaction versus solid state aging of eutectic SnPb on Cu

Journal of applied physics, 2001-05, Vol.89 (9), p.4843-4849

2001

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High-lead flip chip bump cracking on the thin organic substrate in a module package

Microelectronics and reliability, 2012-02, Vol.52 (2), p.455-460

2012

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Intermetallic growth and mechanical behavior of low and high melting temperature solder alloys

Metallurgical and materials transactions. A, Physical metallurgy and materials science, 1994-07, Vol.25 (7), p.1509-1523

1994

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Electron microscopy study of interfacial reaction between eutectic SnPb and Cu/Ni(V)/Al thin film metallization

Journal of applied physics, 2000-01, Vol.87 (2), p.750-754

2000

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Failure morphology after the drop impact test of the ball grid array package with lead-free Sn-3.8Ag-0.7Cu on Cu and Ni under-bump metallurgies

Journal of electronic materials, 2007-03, Vol.36 (3), p.207-213

2007

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Emerging Materials Challenges in Microelectronics Packaging

MRS bulletin, 2003-01, Vol.28 (1), p.68-74

2003

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The mechanical behavior of interconnect materials for electronic packaging

JOM (1989), 1996-05, Vol.48 (5), p.49-53

Frear, D. R.

1996

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Time-dependent deformation behavior of near-eutectic 60Sn-40Pb solder

Metallurgical and materials transactions. A, Physical metallurgy and materials science, 1999-05, Vol.30 (5), p.1301-1313

1999

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Materials issues in area-array microelectronic packaging

JOM (1989), 1999-03, Vol.51 (3), p.22-27

Frear, D R

1999

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Electromigration behavior of lead-free solder flip chip bumps on NiP/Cu metallization

Journal of applied physics, 2008-06, Vol.103 (12), p.123506-123506-5

2008

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Stress–strain characteristics of tin-based solder alloys at medium strain rate

Materials letters, 2008-06, Vol.62 (17), p.3031-3034

2008

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Drop Performance of Land Grid Array Packages as a Function of Cu Content in Lead-free Solder Alloys

Journal of the Korean Physical Society, 2011, 59(21), , pp.402-407

2011

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Coarsening of the Sn-Pb solder microstructure in constitutive model-based predictions of solder joint thermal mechanical fatigue

Journal of electronic materials, 1999-11, Vol.28 (11), p.1290-1298

1999

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Interfacial Morphology and Shear Deformation of Flip Chip Solder Joints

Journal of materials research, 2000-08, Vol.15 (8), p.1679-1687

2000

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Issues related to the implementation of Pb-free electronic solders in consumer electronics

Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu

Electromigration of eutectic SnPb and SnAg3.8Cu0.7 flip chip solder bumps and under-bump metallization

Stress–Strain Characteristics of Tin-Based Solder Alloys for Drop-Impact Modeling

Pb-free solders for flip-chip interconnects

Electromigration of eutectic SnPb solder interconnects for flip chip technology

Morphology of interfacial reaction between lead-free solders and electroless Ni–P under bump metallization

Influence of Substrate Surface Finish Metallurgy on Lead-Free Solder Joint Microstructure with Implications for Board-Level Reliability

Solder reaction-assisted crystallization of electroless Ni–P under bump metallization in low cost flip chip technology

Correction to: Influence of Substrate Surface Finish Metallurgy on Lead-Free Solder Joint Microstructure with Implications for Board-Level Reliability

Solid-state annealing behavior of two high-Pb solders, 95Pb5Sn and 90Pb10Sn, on Cu under bump metallurgy

Wetting reaction versus solid state aging of eutectic SnPb on Cu

High-lead flip chip bump cracking on the thin organic substrate in a module package

Intermetallic growth and mechanical behavior of low and high melting temperature solder alloys

Electron microscopy study of interfacial reaction between eutectic SnPb and Cu/Ni(V)/Al thin film metallization

Failure morphology after the drop impact test of the ball grid array package with lead-free Sn-3.8Ag-0.7Cu on Cu and Ni under-bump metallurgies

Emerging Materials Challenges in Microelectronics Packaging

The mechanical behavior of interconnect materials for electronic packaging

Time-dependent deformation behavior of near-eutectic 60Sn-40Pb solder

Materials issues in area-array microelectronic packaging

Electromigration behavior of lead-free solder flip chip bumps on NiP/Cu metallization

Stress–strain characteristics of tin-based solder alloys at medium strain rate

Drop Performance of Land Grid Array Packages as a Function of Cu Content in Lead-free Solder Alloys

Coarsening of the Sn-Pb solder microstructure in constitutive model-based predictions of solder joint thermal mechanical fatigue

Interfacial Morphology and Shear Deformation of Flip Chip Solder Joints

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