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Effect of O2 Fraction in the Sputter Gas on the Electrical Properties of Amorphous In-Zn-O and the Thin Film Transistor Performance
Ist Teil von
Journal of electronic materials, 2016-12, Vol.45 (12), p.6310-6316
Ort / Verlag
New York: Springer US
Erscheinungsjahr
2016
Quelle
Alma/SFX Local Collection
Beschreibungen/Notizen
Amorphous oxide semiconductors (AOSs) exhibiting high mobility in the range of 10–30 cm
2
/Vs have received significant attention for their application in flexible and transparent electronics such as next-generation displays. Here, we report on how the oxygen volume fraction (vol.%) in the O
2
/Ar sputter gas affects both the electrical properties of sputtered amorphous In-Zn-O (a-IZO) and the threshold voltage of a-IZO thin film transistor (TFT) devices. As the oxygen fraction increases during sputter deposition, the carrier density in a-IZO is adjusted from the heavily-doped regime of >10
20
/cm
3
to the semiconducting regime of <10
17
/cm
3
. A series of bottom-gated TFT devices were fabricated through depositing the channel a-IZO films as a function of O
2
vol.%. All the TFTs manufactured operate in depletion mode and the threshold voltage is found to shift positively with the increasing presence of O
2
in the sputter gas. These results are attributed to both a decrease in oxygen vacancy defects, which donate two free carriers per vacancy, and a subsequent reduction in the a-IZO channel’s carrier density.