Details

Autor(en) / Beteiligte

• Qu, Yan
• Wang, Fang
• Jin, Na
• Guo, Chao

Titel

Simulation Study on a New Type of Cooling Device Used in Heat Dissipation of Server

Ist Teil von

• Applied Mechanics and Materials, 2013-01, Vol.241-244, p.1306-1309

Ort / Verlag

Zurich: Trans Tech Publications Ltd

Erscheinungsjahr

2013

Quelle

Alma/SFX Local Collection

Beschreibungen/Notizen

• A new type of cooling device used for server is designed in this paper. A server is used as a research object. A mathematical model of thermal analysis is established and a temperature distribution is simulated for this case. Then simulated heat dissipation effects of air cooling and evaporative cooling are compared to analyze the feasibility of the plan of forced convection evaporative cooling. The results show that the temperature distribution obtained in the case is more uniform and the temperature of the CPU is more stable when cooled by forced convection evaporative cooling.