Details

Autor(en) / Beteiligte

• Phang, J.C.H.
• Chan, D.S.H.
• Palaniappan, M.
• Chin, J.M.
• Davis, B.
• Bruce, M.
• Wilcox, J.
• Gilfeather, G.
• Chua, C.M.
• Koh, L.S.
• Ng, H.Y.
• Tan, S.H.

Titel

A review of laser induced techniques for microelectronic failure analysis

Ist Teil von

• Proceedings of the 11th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2004 (IEEE Cat. No.04TH8743), 2004, p.255-261

Ort / Verlag

Piscataway NJ: IEEE

Erscheinungsjahr

2004

Quelle

IEEE Electronic Library (IEL)

Beschreibungen/Notizen

• Recent developments have seen the use of scanning focused near infra-red (NIR) laser beams for fault localization and defect characterization in microelectronic failure analysis. Fault localization techniques are based on thermal stimulation and include power alteration techniques such as OBIRCH, TIVA, SEI, and tester based techniques such as RIL-SDL. Defect characterization techniques are based on carrier stimulation and include OBIC, SCOBIC and LIVA. A review of the concepts and application of these techniques together with the instrumentation requirements to effectively deploy these techniques are presented in this paper.