Details

Autor(en) / Beteiligte

• Zheng, P. Y.
• Deng, R. P.
• Gall, D.

Titel

Ni doping on Cu surfaces: Reduced copper resistivity

Ist Teil von

• Applied physics letters, 2014-09, Vol.105 (13)

Ort / Verlag

Melville: American Institute of Physics

Erscheinungsjahr

2014

Quelle

AIP Journals Complete

Beschreibungen/Notizen

• The resistivity of 9.3-nm-thick epitaxial and polycrystalline Cu is reduced by 11%–13% when coated with 0.75 nm Ni. Sequential in situ and ex situ transport measurements show that this is due to electron surface scattering which exhibits a specularity p = 0.7 for the Cu-vacuum interface that transitions to completely diffuse (p = 0) when exposed to air. In contrast, Ni-coated surfaces exhibit partial specularity with p = 0.3 in vacuum and p = 0.15 in air, as Cu2O formation is suppressed, leading to a smaller surface potential perturbation and a lower density of localized surface states, yielding less diffuse electron scattering.