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Semiconductors (Woodbury, N.Y.), 2010-03, Vol.44 (3), p.285-288
2010
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Details

Autor(en) / Beteiligte
Titel
Precipitation of boron in silicon on high-dose implantation
Ist Teil von
  • Semiconductors (Woodbury, N.Y.), 2010-03, Vol.44 (3), p.285-288
Ort / Verlag
Dordrecht: SP MAIK Nauka/Interperiodica
Erscheinungsjahr
2010
Quelle
Alma/SFX Local Collection
Beschreibungen/Notizen
  • Precipitation of boron implanted in silicon with a dose of 1 × 10 16 cm −2 is studied in relation to the concentration of substitutional boron introduced before implantation and before subsequent annealing at 900°C. It is shown that = 2.5 × 10 20 cm −3 is the critical concentration, at which the formation of precipitates is independent of the concentration of point defects introduced by implantation (far from or close to the mean projected range R p ) and constitutes the prevailing channel of deactivation of boron. At lower concentrations close to the equilibrium concentration, precipitation is observed only far from R p , in the regions of reduced concentrations of point defects. At the same time, in the region of R p with a high concentration of point defects, most boron atoms are drawn into clustering with intrinsic interstitial atoms with the formation of dislocation loops and, thus, become electrically inactive as well.

Weiterführende Literatur

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