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Precipitation of boron implanted in silicon with a dose of 1 × 10
16
cm
−2
is studied in relation to the concentration of substitutional boron
introduced before implantation and before subsequent annealing at 900°C. It is shown that
= 2.5 × 10
20
cm
−3
is the critical concentration, at which the formation of precipitates is independent of the concentration of point defects introduced by implantation (far from or close to the mean projected range
R
p
) and constitutes the prevailing channel of deactivation of boron. At lower concentrations
close to the equilibrium concentration, precipitation is observed only far from
R
p
, in the regions of reduced concentrations of point defects. At the same time, in the region of
R
p
with a high concentration of point defects, most boron atoms are drawn into clustering with intrinsic interstitial atoms with the formation of dislocation loops and, thus, become electrically inactive as well.