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Materials characterization, 2021-05, Vol.175, p.111027, Article 111027
2021
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Autor(en) / Beteiligte
Titel
Measuring residual stress in Ti-6Al-4V with HR-EBSD, using reference patterns from annealed material
Ist Teil von
  • Materials characterization, 2021-05, Vol.175, p.111027, Article 111027
Ort / Verlag
United States: Elsevier Inc
Erscheinungsjahr
2021
Quelle
Alma/SFX Local Collection
Beschreibungen/Notizen
  • Elastic strain and residual stress values in an engineering material were determined by high-resolution EBSD (HR-EBSD) using reference patterns from annealed, recrystallized material. Specifically, rolled Ti-6Al-4V sheet was analyzed using HR EBSD in both an as-annealed and a strained state, the latter established via a static two-point bend fixture. The commercial software CrossCourt4 (CC4) was used to evaluate the relative intragranular strain tensor components of the alpha grains mapped by HR-EBSD. The intragranular reference patterns identified in each grain by the software were then replaced with similarly-oriented patterns from scans of the as-annealed, recrystallized material. The CC4 analysis was then repeated to provide calibrated strain and residual stress values. Elastic strains on the order of 10−3 were detected, with corresponding residual stress values on the order of 1 GPa. Subsequent analyses using high energy synchrotron x-ray diffraction showed good correlation with the elastic strains measured by HR-EBSD using the annealed reference patterns. Additionally, the maximum macroscopic stress analytically predicted for two-point bending was in agreement with the residual stress observed. Good repeatability of the methodology and insight into the state of individual grains were also observed. The findings provide encouraging evidence that accurate intragranular and long-range residual stress measurements of engineering significance can be made with HR-EBSD using a physical reference pattern library.
Sprache
Englisch
Identifikatoren
ISSN: 1044-5803
eISSN: 1873-4189
DOI: 10.1016/j.matchar.2021.111027
Titel-ID: cdi_osti_scitechconnect_1798271

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