Details

Autor(en) / Beteiligte

• Yue, Yanan
• Zhang, Jingchao
• Xie, Yangsu
• Chen, Wen
• Wang, Xinwei

Titel

Energy coupling across low-dimensional contact interfaces at the atomic scale

Ist Teil von

• International journal of heat and mass transfer, 2017-07, Vol.110 (C), p.827-844

Ort / Verlag

Oxford: Elsevier Ltd

Erscheinungsjahr

2017

Quelle

Access via ScienceDirect (Elsevier)

Beschreibungen/Notizen

• •The state-of-the-art studies about energy coupling across atomic-scale interfaces are reviewed.•Recent applications and progress about Raman thermometry on interface materials are focused.•Current challenges in experimental studies and opportunities in this area are discussed. The miniaturization in energy devices and their critical needs for heat dissipation have facilitated research on exceptional thermal properties of novel low-dimensional materials. Current studies demonstrated the main challenge for solving thermal transport issues is the large thermal contact resistance across these low-dimensional material interfaces when they are either bundled together or supported by a substrate. A clear understanding of thermal transport across these atomic interfaces through experimental characterization or numerical simulation is important, but nontrivial. Due to instrumentation limit, only a few thermal characterization methods are applicable. Accordingly, many studies have been conducted by theoretical analysis and molecular dynamics to understand the physical process during this ultra-fast and ultra-small thermal transport. In this review, both experimental work and molecular dynamics studies on atomic-scale thermal contact resistance of low-dimensional materials (from zero- to two-dimensional) are reviewed. Challenges as well as opportunities in the study of thermal transport in atomic-layer structures are outlined. Considering the remarkable complexity of physical/chemical conditions, there is still a large room in understanding fundamentals of energy coupling across these atomic-layer interfaces.