Details

Autor(en) / Beteiligte

• Dong, Yanhao
• Chen, I.-Wei
• Olevsky, E.

Titel

Thermal Runaway in Mold-Assisted Flash Sintering

Ist Teil von

• Journal of the American Ceramic Society, 2016-09, Vol.99 (9), p.2889-2894

Ort / Verlag

Columbus: Blackwell Publishing Ltd

Erscheinungsjahr

2016

Quelle

Wiley Blackwell Single Titles

Beschreibungen/Notizen

• Analyzing the temperature evolution in pressureless mold‐assisted flash sintering, we found the same onset condition as in standard flash sintering: When sample's DC or AC Joule heating replaces environment's radiation heating as the dominant power input term, thermal runaway ensues. Various serial and parallel components connected to the sample, including the mold, insulation, and punches, can affect Joule heating and conduction heat loss, thus play an important role in successful mold‐assisted flash sintering.