Details

Autor(en) / Beteiligte

• Ullán, M.
• Allport, P.P.
• Baca, M.
• Broughton, J.
• Chisholm, A.
• Nikolopoulos, K.
• Pyatt, S.
• Thomas, J.P.
• Wilson, J.A.
• Kierstead, J.
• Kuczewski, P.
• Lynn, D.
• Hommels, L.B.A.
• Fleta, C.
• Fernandez-Tejero, J.
• Quirion, D.
• Bloch, I.
• Díez, S.
• Gregor, I.M.
• Lohwasser, K.
• Poley, L.
• Tackmann, K.
• Hauser, M.
• Jakobs, K.
• Kuehn, S.
• Mahboubi, K.
• Mori, R.
• Parzefall, U.
• Clark, A.
• Ferrere, D.
• Gonzalez Sevilla, S.
• Ashby, J.
• Blue, A.
• Bates, R.
• Buttar, C.
• Doherty, F.
• McMullen, T.
• McEwan, F.
• O'Shea, V.
• Kamada, S.
• Yamamura, K.
• Ikegami, Y.
• Nakamura, K.
• Takubo, Y.
• Unno, Y.
• Takashima, R.
• Chilingarov, A.
• Fox, H.
• Affolder, A.A.
• Casse, G.
• Dervan, P.
• Forshaw, D.
• Greenall, A.
• Wonsak, S.
• Wormald, M.
• Cindro, V.
• Kramberger, G.
• Mandić, I.
• Mikuž, M.
• Gorelov, I.
• Hoeferkamp, M.
• Palni, P.
• Seidel, S.
• Taylor, A.
• Toms, K.
• Wang, R.
• Hessey, N.P.
• Valencic, N.
• Hanagaki, K.
• Dolezal, Z.
• Kodys, P.
• Bohm, J.
• Mikestikova, M.
• Bevan, A.
• Beck, G.
• Milke, C.
• Domingo, M.
• Fadeyev, V.
• Galloway, Z.
• Hibbard-Lubow, D.
• Liang, Z.
• Sadrozinski, H.F.-W.
• Seiden, A.
• To, K.
• French, R.
• Hodgson, P.
• Marin-Reyes, H.
• Parker, K.
• Jinnouchi, O.
• Hara, K.
• Bernabeu, J.
• Civera, J.V.
• Garcia, C.
• Lacasta, C.
• Marti i Garcia, S.
• Rodriguez, D.
• Santoyo, D.
• Solaz, C.
• Soldevila, U.

Titel

Embedded pitch adapters: A high-yield interconnection solution for strip sensors

Ist Teil von

• Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment, 2016-09, Vol.831 (C), p.221-228

Ort / Verlag

Netherlands: Elsevier B.V

Erscheinungsjahr

2016

Quelle

Access via ScienceDirect (Elsevier)

Beschreibungen/Notizen

• A proposal to fabricate large area strip sensors with integrated, or embedded, pitch adapters is presented for the End-cap part of the Inner Tracker in the ATLAS experiment. To implement the embedded pitch adapters, a second metal layer is used in the sensor fabrication, for signal routing to the ASICs. Sensors with different embedded pitch adapters have been fabricated in order to optimize the design and technology. Inter-strip capacitance, noise, pick-up, cross-talk, signal efficiency, and fabrication yield have been taken into account in their design and fabrication. Inter-strip capacitance tests taking into account all channel neighbors reveal the important differences between the various designs considered. These tests have been correlated with noise figures obtained in full assembled modules, showing that the tests performed on the bare sensors are a valid tool to estimate the final noise in the full module. The full modules have been subjected to test beam experiments in order to evaluate the incidence of cross-talk, pick-up, and signal loss. The detailed analysis shows no indication of cross-talk or pick-up as no additional hits can be observed in any channel not being hit by the beam above 170mV threshold, and the signal in those channels is always below 1% of the signal recorded in the channel being hit, above 100mV threshold. First results on irradiated mini-sensors with embedded pitch adapters do not show any change in the interstrip capacitance measurements with only the first neighbors connected.