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Evaluation and Solderability of Leadrich and Eutectic Soldercoated Component Leads
Ist Teil von
Soldering & surface mount technology, 1992-03, Vol.4 (3), p.16-20
Ort / Verlag
MCB UP Ltd
Erscheinungsjahr
1992
Link zum Volltext
Quelle
Alma/SFX Local Collection
Beschreibungen/Notizen
A significant number of integrated circuit IC package leads failing solderability tests also had a very thin eutectic solder coating. Poor solderability is attributed to degradation of this coating during various burnin times and temperatures. Techniques were developed to pretin IC leads with leadrich solder 95Pb5Sn as this finish had been reported in the literature to be particularly effective and superior to the eutectic composition in preserving solderability even after long ageing treatments. The present work has not confirmed those recommendations. In fact, surface analyses and various solderability tests performed on steamaged finishes demonstrate that 95Pb5Sn is not a viable alternative to 63Sn37Pb if standard spacecraft soldering practices are to be followed. Good solder wetting was always achieved if the artifically aged leads had a minimum eutectic coating thickness of 57 micrometres.