Details

Autor(en) / Beteiligte

• Li, Guo-Zheng
• Wang, Miao

Titel

A novel preform compaction method for fabricating high-performance Y–Ba–Cu–O single-grain bulk superconductor

Ist Teil von

• Superconductor science & technology, 2022-01, Vol.35 (1), p.15005

Ort / Verlag

IOP Publishing

Erscheinungsjahr

2022

Quelle

Alma/SFX Local Collection

Beschreibungen/Notizen

• Abstract A novel preform compaction method based on one new type of divisible mould was employed for fabricating single-grain YBCO bulk superconductor, which can complete the preform demoulding process through opening of the mould, rather than pushing the preform out in the regular mould. Thus it has natural superiority on eliminating macro-cracks, which has been proved by the sample surface morphology and the trapped field characterization. In addition, the divisible mould pressed sample exhibits higher levitation force and trapped field properties than the regular mould pressed samples, verifying the potentials of the divisible mould on improving the bulk performance. The optical micrograph results prove the superiority of the divisible mould on eliminating tiny cracks on sample surface. The processing facility and sample reliability brought by the divisible mould should also be emphasized, because the crushing and re-pressing of preform when it presents visible cracks can be omitted and the failed samples with surface cracks will no longer appear. Consequently, the experimental efficiency and stability are both enhanced.