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Induction Soldering Process with Integrated Susceptors
Ist Teil von
2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC), 2021, p.1-7
Ort / Verlag
IMAPS-Europe
Erscheinungsjahr
2021
Link zum Volltext
Quelle
IEEE Xplore
Beschreibungen/Notizen
Induction soldering is a widely used process for the interconnection of construction parts. This technology allows a local heating process without putting the whole module into the oven, which minimizes the thermal load and thus improves the reliability of the electronic module and at the same time reduces the energy consumption of the soldering process. In this study, the internal heating of solder material is realized by induction losses within a suitable susceptor material. Therefore, a variety of ferromagnetic materials was examined as susceptor materials and different geometries and application methods were investigated. The soldering process is demonstrated at a laboratory induction setup where a controlled reflow soldering profile was applied.