Details

Autor(en) / Beteiligte

• Kang, Qiushi
• Wang, Chenxi
• Zhou, Shicheng
• Lu, Tian
• Tian, Yanhong

Titel

Low-temperature bonding and interfacial failure behavior of Si/glass and glass/glass chips

Ist Teil von

• 2020 21st International Conference on Electronic Packaging Technology (ICEPT), 2020, p.1-4

Ort / Verlag

IEEE

Erscheinungsjahr

2020

Quelle

IEEE Electronic Library Online

Beschreibungen/Notizen

• Silicon and glass, as the two most common substrates in the semiconductor field, can be integrated into optoelectronic devices, micro/nanofluidic chips and even extended to biological applications. To obtain diverse and reliable micro/nano electromechanical systems, the integrated interface needs to ensure good mechanical properties and corrosion resistance in chemical and biological environments. Here, we propose an inductively coupled plasma with horizontal activation direction which suppresses the formation of damage position on the surface of Si and glass chips, and void-free Si/glass and glass/glass interfaces were achieved at 150 °C. Moreover, immersion tests with different working solutions were designed to investigate the interfacial corrosion resistance. By measuring the adhesive strength and observing the interface, it is found that the strength decreased rapidly after immersing the samples in ethanol for 24 h compared with other solutions. Based on the failure behavior and conventional water corrosion mechanism, the corrosion mechanisms were improved. The results are not only beneficial for the reliability evaluation of devices, but also provide the possibility of de-bonding or even recycling the substrates in the future.