Details

Autor(en) / Beteiligte

• Garner, C.M.
• Gupta, V.
• Bissessur, V.
• Kumar, A.
• Aspandiar, R.

Titel

Challenges in converting to lead-free electronics

Ist Teil von

• Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456), 2000, p.6-9

Ort / Verlag

IEEE

Erscheinungsjahr

2000

Link zum Volltext

• IEEE_Xplore

Quelle

IEL

Beschreibungen/Notizen

• For effective migration to lead-free electronics, the industry must identify a number of lead-free compatible solders, establish an effective assembly process temperature hierarchy, and have a large number of components that are compatible with this thermal hierarchy. In this paper, we propose a temperature hierarchy for lead-free reflow soldering, discuss the critical factors in developing an optimal lead-free reflow profile, and identify the challenges in making packages compatible with the higher solder temperatures associated with lead-free solders. We also briefly review the lead-free materials direction and challenges for solder ball interconnects, component termination and board finishes.