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2019 IEEE 8th Global Conference on Consumer Electronics (GCCE), 2019, p.233-235
2019

Details

Autor(en) / Beteiligte
Titel
Design and Implementation of Illumination Control of High Speed Chip-Back Defects Inspection System
Ist Teil von
  • 2019 IEEE 8th Global Conference on Consumer Electronics (GCCE), 2019, p.233-235
Ort / Verlag
IEEE
Erscheinungsjahr
2019
Link zum Volltext
Quelle
IEEE Xplore
Beschreibungen/Notizen
  • According to the required specifications and analysis for illumination control and architecture design of chip-back defect inspection systems, various tests were performed on the proposed inspection system. The objective of this study was to describe the hardware architecture of a light-emitting diode (LED) illumination environment control module corresponding to the image acquisition module for a chip-back defect inspection system. Providing a sufficiently and evenly illuminated environment, the illumination module can be plugged directly into the structure of the image acquisition area to reduce the space required for arranging the inspection light source and the driving circuit. This increases the flexibility of spatial requirements for using the proposed system in operations with various machines.
Sprache
Englisch
Identifikatoren
DOI: 10.1109/GCCE46687.2019.9015562
Titel-ID: cdi_ieee_primary_9015562

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