Details

Autor(en) / Beteiligte

• Ozturk, Emre
• Dikkers, Mike J.
• Batenburg, Kevin M.
• Salm, Cora
• Schmitz, Jurriaan

Titel

RFID Tag Failure after Thermal Overstress

Ist Teil von

• 2019 IEEE International Integrated Reliability Workshop (IIRW), 2019, p.1-4

Ort / Verlag

IEEE

Erscheinungsjahr

2019

Quelle

IEEE Xplore

Beschreibungen/Notizen

• In this work the failure modes and mechanisms are investigated of a commercially available RFID tag, when it is exposed to extreme temperatures well beyond specifications. Both erroneous functioning and malfunctioning are observed after a thermal cycle exposing the tag to an elevated temperature in the 300-550 °C range. Void formation is the dominant failure, leading to a complete malfunction of the tag. Sporadically, the RFID tag returns a wrong identification code after extreme thermal cycling. This effect is caused by relatively weak bits flipping from "1" to "0" and seems consistent with existing retention models.