Details

Autor(en) / Beteiligte

• Qayyum, Jubaid Abdul
• Abt, Marvin
• Roch, Aljoscha
• Ulusoy, Ahmet Cagri
• Papapolymerou, John

Titel

Ultra wideband 3D interconnects using aerosol jet printing up to 110 GHz

Ist Teil von

• 2017 12th European Microwave Integrated Circuits Conference (EuMIC), 2017, p.372-375

Ort / Verlag

European Microwave Association

Erscheinungsjahr

2017

Quelle

IEEE Electronic Library Online

Beschreibungen/Notizen

• In this paper, the authors present proof of concept 3D printed interconnects fabricated using aerosol jet printing (AJP) technology. A trapezoidal structure was 3D printed on Liquid Crystal Polymer (LCP) and Coplanar Waveguides (CPW) were printed on top of them to imitate mm-wave packaging. The printing was done using silver nanoparticle ink that acquired 40% conductivity of the bulk silver after sintering at 200 °C for one hour. Scattering Parameters (S-parameters) were simulated and measured from 1 GHz to 110 GHz. The CPW interconnects yielded insertion loss of as low as 0.49 dB/mm including the trapezoid, and with a loss of 0.38 dB/mm on LCP substrate at 110 GHz. This work represents AJP as a solution for cost-effective system-on-package (SoP)/ millimeter-wave (mm-wave) systems.