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2017 18th International Conference on Electronic Packaging Technology (ICEPT), 2017, p.1143-1146
2017
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Autor(en) / Beteiligte
Titel
A hybrid genetic algorithm for automatic layout design of power module
Ist Teil von
  • 2017 18th International Conference on Electronic Packaging Technology (ICEPT), 2017, p.1143-1146
Ort / Verlag
IEEE
Erscheinungsjahr
2017
Quelle
IEEE Electronic Library Online
Beschreibungen/Notizen
  • The parasitic parameters in the power module have a negative effect on switching losses and dynamic characteristics. With the rapid development of integrated circuit technology, the high current, high frequency and high pressure working environment put forward higher requirements for the switching circuit delay, reliability and power consumption. The rational layout of the power module is the key to reducing the parasitic parameters. However, today's designers often propose the layout manually, which is time- and money-consuming. Recently, automatic layout design of power modules has attracted more and more attention. In this paper, a hybrid genetic algorithm is used to design the layout automatically by MATLAB in order to optimize the layout with the lowest parasitic effect. Then we used the Q3D software to verify the automatic calculation results by comparing the calculated layout with some others in manual ways.
Sprache
Englisch
Identifikatoren
DOI: 10.1109/ICEPT.2017.8046643
Titel-ID: cdi_ieee_primary_8046643

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