Details

Autor(en) / Beteiligte

• Panarello, S.
• Triolo, C.
• Garesci, F.
• Patane, S.
• Bille, G.
• Patti, D.
• Burian, L.
• Gazzo, D.
• Petenyi, S.
• Ribellino, C.

Titel

Improving ICs reliability with high speed thermal mapping

Ist Teil von

• 2017 14th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD), 2017, p.1-4

Ort / Verlag

IEEE

Erscheinungsjahr

2017

Quelle

IEEE/IET Electronic Library

Beschreibungen/Notizen

• The power elements are the weak parts of integrated circuits (ICs), in fact, through these elements the power is usually dissipated as heat. This provides two effects: non-uniform generation of the heat across the die and temperature gradients. Understanding this phenomena is very important for choosing the right location of sensitive components, like thermal sensors, in order to improve reliability. Furthermore, an accurate thermal modeling for reliability evaluations can be obtained and validated if the temperature distribution on the chip is experimentally measured, reconstructing the thermal maps. Here, we propose a suitable instrument to perform a direct measure of thermal distributions. The instrument has to be able to recognize small partitions of the chip and to store fast thermal events in the range below μs. With its application, a great improvement can be obtained for ICs reliability.