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IEEE transactions on very large scale integration (VLSI) systems, 2017-09, Vol.25 (9), p.2538-2551
2017

Details

Autor(en) / Beteiligte
Titel
Smart Grid on Chip: Work Load-Balanced On-Chip Power Delivery
Ist Teil von
  • IEEE transactions on very large scale integration (VLSI) systems, 2017-09, Vol.25 (9), p.2538-2551
Ort / Verlag
IEEE
Erscheinungsjahr
2017
Link zum Volltext
Quelle
IEEE/IET Electronic Library
Beschreibungen/Notizen
  • In this paper, a dynamic on-chip power delivery system for chip multiprocessors (CMPs) is proposed, analogous to the smart grid deployed for large-scale energy distribution. The system includes underprovisioned on-chip voltage regulators (VRs) interconnected through a switch network. The peak current rating of the VRs is selected to meet only the average current demand of the cores. A real-time load-balancing algorithm is developed to reconfigure the power delivery network (PDN) by combining the output of multiple VRs when the workload demand exceeds the peak current rating of a single regulator. An operating system level task scheduling heuristic distributes the workloads on the cores such that the required reconfiguration of the PDN is minimized. Simulation results for the proposed power delivery system indicate up to a 44% reduction in the energy consumption of the CMP. In addition, the on-chip footprint of the PDN, including the on-chip VRs and the switching network, is reduced by at least 23%. The proposed cross-layer power management technique is an optimum solution for power-constrained many-core architectures implemented in advanced technology nodes.
Sprache
Englisch
Identifikatoren
ISSN: 1063-8210
eISSN: 1557-9999
DOI: 10.1109/TVLSI.2017.2699644
Titel-ID: cdi_ieee_primary_7938724

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