Details

Autor(en) / Beteiligte

• Cadiou, S.
• Quendo, C.
• Schlaffer, E.
• Pessl, W.
• Le Fevre, A.
• Brizoux, M.
• Baudet, D.

Titel

SIW Q-band filters using advanced multilayer PCB technology

Ist Teil von

• 2014 44th European Microwave Conference, 2014, p.1052-1055

Ort / Verlag

European Microwave Association

Erscheinungsjahr

2014

Quelle

IEEE Electronic Library (IEL)【Remote access available】

Beschreibungen/Notizen

• This paper deals with the design of Q-band filters using a low-cost multilayered Printed Circuit Board (PCB) substrate. In order to meet strong electrical specifications, the Substrate Integrated Waveguide (SIW) technique has been used to take profit of the complete build-up of the multilayered PCB. Advanced fabrication techniques of vias and micro-vias have also been developed in this project to implement 4 th and 6 th -order filters in this technology. The challenge here is to use a standard PCB process to design complex microwave devices that usually require accurate fabrication process and very low tolerances, especially in such frequency ranges. Based on that, two 2.8×8mm 2 prototypes have been designed, simulated and fabricated on a 1mm-thick PCB made of copper and blend of high performance resin material. Regarding the results of these filters, measured insertion & return losses are in a very good agreement with the simulation while exhibiting high rejections and low footprint.