Details

Autor(en) / Beteiligte

• Wilson, J.S.
• Raad, P.E.
• Price, D.C.

Titel

Transient Adaptive Thermal Simulation of Microwave Integrated Circuits

Ist Teil von

• Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 1998, p.1-7

Ort / Verlag

IEEE

Erscheinungsjahr

1998

Link zum Volltext

• IEEE_Xplore

Quelle

IEEE Xplore

Beschreibungen/Notizen

• Integrated circuits with sub-micron features require complicated three-dimensional modeling including multiple materials and temperature-dependent thermal conductivity. A transient multiple-grid solution technique is presented which adaptively handles the large spatial and temporal scale ranges associated with integrated circuit modeling. Transient thermal modeling computational requirements are reduced by two orders of magnitude by the development and application of a transient multiple-grid solution technique. Experimental validation testing confirms the need for fast and accurate thermal simulation tools.