Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat. No.97TH8268), 1997, p.158-168
1997
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Details
- Autor(en) / Beteiligte
- Titel
- Hygrothermal reliability evaluation of plastic IC packages with computer-aided engineering tools
- Ist Teil von
- Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat. No.97TH8268), 1997, p.158-168
- Ort / Verlag
- IEEE
- Erscheinungsjahr
- 1997
- Quelle
- IEEE/IET Electronic Library (IEL)
- Beschreibungen/Notizen
- This paper presents the development and application of a computer-aided engineering tool, EPACK(TM), for hygro-thermal-mechanical performance and reliability evaluation of plastic IC packages. With this user-friendly and fully automated tool, a packaging engineer can perform reliability evaluation of a plastic IC package in minutes.
- Sprache
- Englisch
- Identifikatoren
- ISBN: 9780780338654, 0780338650DOI: 10.1109/PEP.1997.656486Titel-ID: cdi_ieee_primary_656486