Details

Autor(en) / Beteiligte

• Fettweis, Gerhard
• ul Hassan, Najeeb
• Landau, Lukas
• Fischer, Erik

Titel

Wireless interconnect for board and chip level

Ist Teil von

• 2013 Design, Automation & Test in Europe Conference & Exhibition (DATE), 2013, p.958-963

Ort / Verlag

EDA Consortium

Erscheinungsjahr

2013

Link zum Volltext

• IEEE_Xplore

Quelle

IEEE/IET Electronic Library

Beschreibungen/Notizen

• Electronic systems of the future require a very high bandwidth communications infrastructure within the system. This way the massive amount of compute power which will be available can be inter-connected to realize future powerful advanced electronic systems. Today, electronic inter-connects between 3D chipstacks, as well as intra-connects within 3D chipstacks are approaching data rates of 100 Gbit/s soon. Hence, the question to be answered is how to efficiently design the communications infrastructure which will be within electronic systems. Within this paper approaches and results for building this infrastructure for future electronics are addressed.