Details

Autor(en) / Beteiligte

• Henkel, J.
• Ebi, T.
• Amrouch, H.
• Khdr, H.

Titel

Thermal management for dependable on-chip systems

Ist Teil von

• 2013 18th Asia and South Pacific Design Automation Conference (ASP-DAC), 2013, p.113-118

Ort / Verlag

IEEE

Erscheinungsjahr

2013

Quelle

IEEE Electronic Library Online

Beschreibungen/Notizen

• Dependability has become a growing concern in the nano-CMOS era due to elevated temperatures and an increased susceptibility to temperature of the small structures. We present an overview of temperature-related effects that threaten dependability and a methodology for reducing the dependability concerns through thermal management utilizing the concept of aging budgeting.