Details

Autor(en) / Beteiligte

• Righi, M.
• Tardioli, G.
• Cascio, L.
• Hoefer, W.J.R.

Titel

Time-domain characterization of packaging effects via segmentation technique

Ist Teil von

• IEEE transactions on microwave theory and techniques, 1997-10, Vol.45 (10), p.1905-1910

Ort / Verlag

IEEE

Erscheinungsjahr

1997

Link zum Volltext

• IEEE_Xplore

Quelle

IEEE Electronic Library (IEL)

Beschreibungen/Notizen

• The analysis of a monolithic microwave integrated circuit (MMIC) placed in a surface-mount plastic package is presented. Critical issues such as poor grounding conditions and crosstalk are addressed and discussed. The significance of a full-wave characterization of the component is shown. Results are validated with data available in the literature showing good agreement. A segmentation approach is also proposed to efficiently analyze the problem. The package effects are extracted and can be combined with MMIC parameters at the design stage to predict the performance of the packaged circuit.