Details

Autor(en) / Beteiligte

• Perrot, S.
• Randle, Y.
• Fresquet, G.
• Le Bellego, D.
• Petitgrand, S.
• Coste, P.
• Bosseboeuf, A.

Titel

A versatile optical system for metrology and defects inspection of 3D integration processes

Ist Teil von

• 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, 2012, p.191-191

Ort / Verlag

IEEE

Erscheinungsjahr

2012

Quelle

IEEE Xplore

Beschreibungen/Notizen

• 3D Integration of miniaturized systems at wafer level generates new needs of metrology and defects inspection for the control of temporary or permanent wafer bonding, of wafer thinning, of via interconnects technology and of wafer/die stacks. In this paper we demonstrate the capabilities of a versatile optical measurement system combining several microscopy and interferometry techniques in the visible and near infrared wavelength range.